发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board like a TAB tape for LCD having such a structure as to be easily manufactured by less number of more simplified manufacturing processes, and also to provide its manufacturing method. SOLUTION: In the method of manufacturing the wiring board configured such that conductor wiring is formed on an insulation film 24, a stamp liquid 22a containing conductor particles is attached to the convex portion 21a of a stamp mold 21 having a shape like the conductor wiring, and then stamped on the insulation film 24, thereby forming the conductor wiring 25 on the insulation film 24. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032891(A) 申请公布日期 2005.02.03
申请号 JP20030194747 申请日期 2003.07.10
申请人 HITACHI CABLE LTD 发明人 ASHIZUKA NORIHIRO;OKIKAWA HIROSHI;OKABE NORIO;ENDO HIROHISA
分类号 H05K1/02;H01L21/60;H05K3/20;H05K3/24;H05K3/38;(IPC1-7):H05K3/20 主分类号 H05K1/02
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