INORGANIC POWDER-CONTAINING RESIN COMPOSITION, FILM-FORMING MATERIAL LAYER, TRANSFER SHEET, METHOD FOR PRODUCING DIELECTRIC LAYER-FORMING SUBSTRATE AND DIELECTRIC LAYER FORMING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To obtain an inorganic powder-containing resin composition that is a raw material for a film-forming material layer having sufficient flexibility and excellent cohesive power (strength), the film-forming material layer, a transfer sheet and a dielectric layer comprising the resin composition and to provide a method for producing a dielectric layer-forming substrate and to obtain the dielectric layer-forming substrate. SOLUTION: The inorganic powder-containing resin composition comprises inorganic powder and a binder. The binder comprises a (meth)acrylic polymer (A) having 50,000-500,000 weight-average molecular weight and -70 to 30°C glass transition temperature and a (meth)acrylic oligomer (B) having 500-10,000 weight-average molecular weight and -70 to 30°C glass transition temperature. COPYRIGHT: (C)2005,JPO&NCIPI