发明名称 |
Semiconductor device and method of fabricating the same, circuit board, and electronic instrument |
摘要 |
A method of fabricating a semiconductor device, including: preparing a wiring board on which is mounted a first semiconductor chip having a plurality of first pads; electrically connecting each of the first pads to an interconnecting pattern of the first semiconductor chip by a wire; providing resin paste on the first semiconductor chip; mounting a second semiconductor chip having a plurality of second pads on the first semiconductor chip with the resin paste interposed therebetween; and forming a spacer by hardening the resin paste to fix the first and second semiconductor chips together, wherein the spacer is formed to extend under the second pads and further outward; and wherein the highest portion of the wire is disposed on the outer side of the first semiconductor chip.
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申请公布号 |
US2005023666(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20040868796 |
申请日期 |
2004.06.17 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
OGATA YOSHIHARU |
分类号 |
H01L25/18;H01L21/50;H01L21/58;H01L23/31;H01L23/52;H01L25/065;H01L25/07;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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