POLISHING APPARATUS, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To reduce an amount of abrasive compound slurry to be consumed in polishing without immersing a wafer in the abrasive compound slurry.

SOLUTION: A polishing table 1 is uprightly arranged in a reservoir 7 such that the lower part of the polishing table 1 is immersed in the abrasive compound slurry 8. While a retainer ring 4 and the wafer W are being pushed against a polishing cloth 2 by means of a polishing head 5, the wafer W is polished by turning the polishing table 1 and the polishing head 5.

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