发明名称 Housing assembly for stacking multiple computer modules
摘要 This invention is directed towards assemblies of electrical or electronic circuit boards. More specifically, the present invention relates to an assembly for housing multiple computer circuit boards. The assembly include a housing that has several railing coupled to the housing. A connector is structurally and electrically coupled to the railings for hanging the computer circuit boards. Structural coupling between the connector and the railing is accomplished by placing the connector in contact with the railing in a file hanging method. This contact also creates an electrical coupling and establishes an electrical connection between the connector and the railing.
申请公布号 US2005024821(A1) 申请公布日期 2005.02.03
申请号 US20030629320 申请日期 2003.07.28
申请人 ARIPPOL DERICK 发明人 ARIPPOL DERICK
分类号 G06F1/18;G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/18
代理机构 代理人
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