| 摘要 |
PROBLEM TO BE SOLVED: To achieve the simultaneous formation of a wiring pattern having a large sectional area and to facilitate mold releasing from a base material with good adhesive properties of a conductor with the base material. SOLUTION: A method for manufacturing a tape carrier for a semiconductor device includes steps for manufacturing a stamper 20 forming a wiring pattern made of a protrusion 21, and roughing the surface of the protrusion 21 of the wiring pattern 21 to a roughed surface 22. The method further includes steps for pressing an integrated base material 11, and transferring a pattern groove 12 for wiring to the base material 11. At this time, the roughed surface 22 of the protrusion of the wiring pattern 21 of the stamper 20 is transferred to the the bottom of the pattern groove 12, and the roughed surface 12 is formed on the groove bottom. After the stamper 20 is released from the base material 11, a conductive material 15 is filled in the pattern groove 12 for wiring transferred to the base material 1 as the tape carrier for the semiconductor device. In order to make the releasability of the stamper 20 from the base material 11 good, it is preferable to coat the surface brought into contact with the stamper 20 at the base material 11 with a lubricative film. COPYRIGHT: (C)2005,JPO&NCIPI
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