发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an excellent semiconductor device which can carry bipolar transistors having different current amplification factors without increasing a cost required to manufacture the semiconductor device and to provide a method for manufacturing the same in the semiconductor device and the method for manufacturing the same which carries the bipolar transistor on a semiconductor substrate. SOLUTION: The method for manufacturing the semiconductor device includes steps for forming a collector layer, an insulating film on the semiconductor substrate, forming two base opening regions having different widths on the insulating film, forming two base layers to cover the two base opening regions after its epitaxial growth, and forming an emitter layer on the two base layers. The first base layer is formed uniformly in the base opening region having a wide width, and the second base layer is formed in a plug shape by embedding in the base opening region having the narrow width. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032741(A) 申请公布日期 2005.02.03
申请号 JP20030192674 申请日期 2003.07.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUJII TAIZO
分类号 H01L21/331;H01L29/732;(IPC1-7):H01L21/331 主分类号 H01L21/331
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