发明名称 |
MOUNT FOR SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
A device includes a submount, and a semiconductor light emitting device mounted on first and second conductive regions on a first side of the submount in a flip chip architecture configuration. The submount has third and fourth conductive regions on a second side of the submount. The third and fourth conductive regions may be used to solder the submount to structure such as a board, without the use of wire bonds. The first and third conductive regions are electrically connected by a first conductive layer and the second and fourth conductive regions are electrically connected by a second conductive layer. The first and second conductive layers may be disposed on the outside of the submount or within the submount.
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申请公布号 |
US2005023548(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20030632719 |
申请日期 |
2003.07.31 |
申请人 |
BHAT JEROME C.;ELPEDES CRESENTE S.;MARTIN PAUL S.;RUDAZ SERGE L. |
发明人 |
BHAT JEROME C.;ELPEDES CRESENTE S.;MARTIN PAUL S.;RUDAZ SERGE L. |
分类号 |
H01L33/62;H05K3/34;(IPC1-7):H01L27/15 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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