发明名称 |
Packaged microelectronic devices and methods of forming same |
摘要 |
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of the invention, a lead frame and a die are releasably attached to a support, an encapsulant is applied, and the support can be removed to expose back contacts of the lead fingers and a back surface of the die. One microelectronic device assembly of the invention includes a die having an exposed back die surface; a plurality of electrical leads, each of which includes front and back electrical contacts; bonding wires electrically coupling the die to the electrical leads; and an encapsulant bonded to the die and the electrical leads. The rear electrical contacts of the electrical leads may be exposed adjacent a back surface of the encapsulant in a staggered array.
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申请公布号 |
US2005023655(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20040929613 |
申请日期 |
2004.08.30 |
申请人 |
FEE SETHO SING;CHYE LIM THIAM;SENG ERIC TAN SWEE |
发明人 |
FEE SETHO SING;CHYE LIM THIAM;SENG ERIC TAN SWEE |
分类号 |
H01L21/56;H01L21/68;H01L23/31;H01L23/495;(IPC1-7):H01L21/48;H01L23/34 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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