SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND PERSONAL COMPUTER CARD

摘要

A semiconductor device used in an electronic device comprises a semiconductor chip wherein a transistor having two electrodes on a major surface and an electrode on the back surface is formed; two electrically independent electrode plates connected to the respective electrodes on the major surface; an electrode plate electrically connected to the electrode on the back surface of the semiconductor chip; and an encapsulant made of an insulating resin, covering the lateral surfaces of the semiconductor chip, and placed in the space between the electrode plates. The package and the electrode plates shape the semiconductor device into a hexahedron. An active portion of the transistor is located on the major surface of the semiconductor chip and the two electrodes are arranged, with the active portion interposed therebetween. The electrode plates arranged on the major surface of the semiconductor chip have lateral surfaces facing to each other and provided with a recess for preventing the electrode plates from coming off the encapsulant.