WIRING BOARD EMBEDDED WITH SPHERICAL SEMICONDUCTOR ELEMENT

摘要

A double-sided or multilayer wiring board having high-density wiring is obtained by incorporating a spherical semiconductor element in an insulating substrate composing the wiring board, and a thin electronic apparatus can be provided using such a wiring board. Furthermore, flexible double-sided or multilayer wiring board capable of being housed in a limited space while keeping a desired shape can be provided by incorporating the spherical semiconductor element, and a thin electronic apparatus can be provided using a variety of such wiring boards by imparting different types of flexibility to a desired part of such a wiring board, as required.