发明名称 |
CORRUGATED STRUCTURES AND METHOD FOR THERMOFORMING PACKAGES |
摘要 |
<p>A corrugated structure (100) having a first flat layer (10), a first corrugated layer (20) secured to the first flat layer (10), a second flat layer (30) having a first side (31) and a second side (32), wherein the first side (31) is secured to the first corrugated layer (20) on a side opposite of the first flat layer, a coating layer (40) secured to the second side (32) of the second flat layer (30), wherein the coating layer (40) has a melting temperature of at least about 450 degrees Fahrenheit and chloroform-soluble extractives of at most about 0.5 milligrams per square inch.</p> |
申请公布号 |
WO2005009658(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
WO2004US23285 |
申请日期 |
2004.07.21 |
申请人 |
MEADWESTVACO CORPORATION;MASON, MARK, OLIN;CALVERT, BARRY, GENE |
发明人 |
MASON, MARK, OLIN;CALVERT, BARRY, GENE |
分类号 |
B32B3/28;B32B29/06;B65H54/46;(IPC1-7):B23B29/06 |
主分类号 |
B32B3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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