PHOTOSENSITIVE RESIN COMPOSITION, LAYERED PRODUCT AND FLEXIBLE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in developability and flexibility when an insulating layer of a flexible wiring board is formed, a layered product excellent in developability and flexibility, and a flexible wiring board excellent in flexibility.

SOLUTION: The photosensitive resin composition used for forming an insulating layer of a flexible wiring board contains a photosensitive resin and a Barcol hardness stipulated by JIS K 7060 after a curing reaction of the photosensitive resin composition is ≤60. The layered product 1 is obtained by stacking a layer 2 consisting of the photosensitive resin composition and a carrier film 3. The flexible wiring board comprises an insulating layer consisting of the photosensitive resin composition and a conductor circuit formed on one side of the insulating layer.

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