SEMICONDUCTOR DEVICE SEALING METAL DIE AND SEMICONDUCTOR DEVICE SEALING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device sealing metal die and semiconductor device sealing method in which an internal structure and a control system are simplified and a high-function semiconductor device can be sealed with resin.

SOLUTION: A pin-point gate 38 is provided on the line that is positioned on the lower side of an inner lead 55 and connects approximately the centers of the opposed sides of a semiconductor device 50, on a bottom surface of a cavity 61 confronted to a lower surface of an island 52.

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