| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a recyclable IC card capable of easily peeling and re-covering an attached over film with an adhesive layer, without machine grinding or solvent removal or without causing glue to remain. <P>SOLUTION: The recyclable card includes a card body, a film covering over at least one main surface of the card body, and an adhesive layer sticking the film covering over on the card body so as to be peelable; the adhesive layer consists of a heat-releasable adhesive composition, including a crystalline polymer and an adhesive polymer; and the card body is recycled by sticking a new film covering over via the adhesive, after peeling the adhesive layer with the film covering over. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
