| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which very simple multilayer wiring can be formed without deteriorating the electrical characteristics of the wiring nor causing defective contacts, etc., between multilayered wiring. SOLUTION: The method of forming the multilayer wiring, in which first and second conductive layers 14 and 16 are laminated upon another through an insulating layer 26 and connected to each other through a through hole 28 formed in the insulating layer 26, includes a step of forming the first conductive layer 14 on a substrate 10, a step of forming a mask which is widened upward from the conductive layer 14 side in the forming area of the through hole 28 provided on the conductive layer 14, and a step of forming the insulating layer 26 on the conductive layer 14 except the formed mask. The method also includes a step of forming the through hole 28 in the insulating layer 26 after removing the mask and a step of forming a conductive member 15 in the through hole 28 and the second conductive layer 16 in a state where the layer 16 is connected to the member 15. COPYRIGHT: (C)2005,JPO&NCIPI |
