| 摘要 |
PROBLEM TO BE SOLVED: To provide a package which can be thoroughly downsized to flip-chip package a semiconductor element 27. SOLUTION: A method for manufacturing the package includes steps for forming a slender groove 57 by irradiating one surface of a substrate 56 made of a synthetic resin with a laser beam, Ni-plating on the groove 57, cutting out a slender pin 47 formed by the groove 57 with the laser beam, and standing the base end 49 of this pin 47 on a base material 48 molded by using a stamper to constitute a mold 44. The method also includes steps for supplying a synthetic resin to a mold cavity 84 defined by the mold 44 obtained thus, and transfer-molding the synthetic resin to form a through hole 23 having, for example, a diameter of 20μm and an aspect ratio 5. A bump 24 having, for example, a diameter of 50μm and a depth of 10μm can be formed at the end of the through hole 23. COPYRIGHT: (C)2005,JPO&NCIPI |
