| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and a device for foreign body removal that can remove even a foreign matter composed of various materials sticking on the surface of a substrate to be treated such as a semiconductor wafer, a flat panel display substrate, a reticle, a mask, etc., are adaptive to, particularly, a substrate to be treated of a larger size (larger area), and can easily remove the sticking foreign matter without damaging the surface of the substrate to be treated nor make it re-stick on the other place. SOLUTION: This foreign matter removing device 1 is equipped with a means 20 of forming a water film by supplying steam to the substrate P to be treated having the stuck foreign matter, a means 22 of vibrating the substrate P to be treated, a means 19 of blowing air to the substrate P to be treated, a means 15 of irradiating a foreign-matter stuck part of the substrate to be treated with a laser beam, and a means 18 of sucking the foreign matter peeled off from the substrate P to be treated. COPYRIGHT: (C)2005,JPO&NCIPI
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