| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin plate transferring method for steadily transferring a thin plate from the source to the destination without deformation or damage, a semiconductor chip mounting method for transferring the semiconductor chip to and mounting the same on a wired substrate, a semiconductor-mounted substrate and an electronic device high in reliability, and an electronic component having the device. SOLUTION: In this semiconductor chip mounting method, a semiconductor chip P (thin plate) is transferred from the source to the destination with the semiconductor chip P held on the holding surface 2 of a holding member 1 with a liquid Q in between, and is mounted on a wired substrate 20. The mounting method comprises a first step of forming a liquid drop Q1 on the holding surface 2, a second step of making the holding surface 2 hold the semiconductor chip P preset in the source with help of surface tension between the holding surface 2 and the liquid Q, a third step of transferring the semiconductor chip P to the destination as held on the holding surface 2, and a fourth step of separating the semiconductor chip P from the holding surface 2 at the destination. COPYRIGHT: (C)2005,JPO&NCIPI
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