| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of easily assembling an electronic substrate, constituted of a plurality of substrates, by inserting a connecting device having a flange unit 3a. SOLUTION: In order to connect a plurality of electronic substrates, inserting holes 1a, 2a are provided at the opposing connecting parts of a first electronic substrate 1 and a second electronic substrate 2, then, pins 3 having the flange unit 3a are inserted into the holes to solder 5 them through a flow method of construction whereby the substrates can be connected electrically. COPYRIGHT: (C)2005,JPO&NCIPI
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