发明名称 PATTERNING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a pattern by imparting solubility to a material on a substrate as a means for supplying the material onto the substrate during transfer thereby supplying liquid onto the substrate. SOLUTION: A substrate 4 is coated with a patterning heat sensitive material having hydrophilic and hydrophobic properties and immersed into ethylene glycol of 90°C in order to perform hydrophilic treatment on the entire surface before a hydrophilic part 6 and a hydrophobic part 5 are formed by writing on the substrate with a laser beam. A transfer plate 1 is then coated with a soluble material, i.e. silver colloid aqueous solution, and dried. When it is touched to the substrate 4, silver particles are dissolved as colloidal aqueous solution only at the patterned part on the substrate 4 and a wiring pattern is formed by heating the substrate 4. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032862(A) 申请公布日期 2005.02.03
申请号 JP20030194268 申请日期 2003.07.09
申请人 RICOH CO LTD 发明人 OKURA HIDEAKI;YOSHIDA YOSHIHIRO;SANO TAKESHI;KOBAYASHI HIROSHI
分类号 H05K3/00;H05K3/10;H05K3/12;(IPC1-7):H05K3/10 主分类号 H05K3/00
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