发明名称 METHOD AND APPARATUS FOR SEALING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus wherein a substrate on which light emitting elements are mounted and in the case where a glass plate are laminated and sealed using a sealing resin, the sealing resin has no voids and a uniform thickness. SOLUTION: The uncured sealing resin 21 is slantingly printed on the glass substrate 11 on which the organic EL elements 15 are mounted by the screen-printing method such that the resin thickness is thinner at one end 11a of the glass substrate 11 and thicker at the other end 11b thereof. Then, the glass plate 51 is overlapped on the sealing resin 21, and the resultant is passed from the other end 11b having the thick sealing resin 21 through between two upper and lower rolls 45a, 45b with a predetermined clearance, whereby the thick sealing resin 21 is squeezed and moved to the thin side, resulting in the sealing resin 21 containing no void and having a uniform thickness. The sealing resin 21 is then cured, thereby completing the sealing. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032682(A) 申请公布日期 2005.02.03
申请号 JP20030273407 申请日期 2003.07.11
申请人 SONY CORP 发明人 KUSANO HIDETOSHI;ASAMI HIROSHI
分类号 H05B33/04;H01L21/56;H01L51/50;H05B33/14;(IPC1-7):H05B33/04 主分类号 H05B33/04
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