| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive film complex which can be formed even on a substrate poor in heat resistance, has superior adhesive properties with the substrate and stable high electrical conductivity. SOLUTION: A method of forming the conductive film complex is formed by the processes of forming an intermediate layer composed of a water-soluble resin or a hydrophilic resin on the substrate, and coating the surface of the intermediate layer with a metal colloid solution. COPYRIGHT: (C)2005,JPO&NCIPI
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