| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate substrate for shortening the time for forming with shortening of the time for adhering by using a thermoplastic resin fusing as an adhesive at a temperature lower than that of an insulating layer. SOLUTION: The substrate comprises conductors 2a, 2b forming parallel and tabular conductive layers; an inter-layer insulating layer 1c made of sheet-like thermoplastic resin arranged between the conductors 2a, 2b; outermost insulating layers 1a, 1b for plating the conductors 2a, 2b and made of sheet-like thermoplastic resin; electrodes 4a, 4b connected respectively to each conductor 2a, 2b; and adhesive layers 3a to 3d interposing between adjacent conductors and insulating layers and between adjacent insulating layers and made of thermoplastic resin fusing at the lower temperature than that of the insulating layers. COPYRIGHT: (C)2005,JPO&NCIPI
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