发明名称 |
Packaged microelectronic components |
摘要 |
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.
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申请公布号 |
US2005026325(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20040922209 |
申请日期 |
2004.08.19 |
申请人 |
KOON ENG MEOW;WAF LOW SIU;YU CHAN MIN;POO CHIA YONG;LENG SER BOK;WEI ZHOU |
发明人 |
KOON ENG MEOW;WAF LOW SIU;YU CHAN MIN;POO CHIA YONG;LENG SER BOK;WEI ZHOU |
分类号 |
H01L23/31;H01L23/495;H01L25/10;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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