发明名称 |
Metallisierbare Polypropylenfolie |
摘要 |
<p>The present invention relates to the improvement of metal bond strength in polypropylene films surface treated at higher levels through the addition to the basic isotactic polypropylene (iPP) polymer of an amount of syndiotactic polypropylene (sPP) in an amount no more than about 10 percent by weight and preferably in an amount between about 0.5 percent and about 8 percent by weight. The invention encompasses both the resulting metallized polypropylene films with enhanced bond strength and the process for producing such films. The prescribed use provides improved bonding properties over a simple non-blended isotactic polypropylene homopolymer, while maintaining at acceptable levels the optical and physical characteristics of a film made from non-blended iPP homopolymer. At increasing percentages of sPP above the preferred levels, bond strength continues to increase, but a deterioration in other properties may be noted, particularly in the optical property haze.</p> |
申请公布号 |
DE69828354(D1) |
申请公布日期 |
2005.02.03 |
申请号 |
DE1998628354 |
申请日期 |
1998.10.16 |
申请人 |
TOTAL PETROCHEMICALS RESEARCH FELUY, SENEFFE |
发明人 |
WHEAT, WILLIAM R.;HANYU, AIKO |
分类号 |
C08L23/12;(IPC1-7):B32B27/32;B32B15/08;C08J5/18 |
主分类号 |
C08L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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