发明名称 SIMULATED PATINA FOR COPPER
摘要 <p>A process for imparting a simulated patina appearance to a copper substrate (11). The appearance of patination is created by applying interspersed spots (15, 16, 17) of colorant, preferably a paint, with the remaining portion of the substrate (11) being exposed for natural patination. The interspersed spots may be produced by screen printing, spattering/spraying, or by mechanical removal of colorant. Non-uniformity may be accomplished by varying the volume of colorant sprayed during the application process or by varying the relative movement of the spray and substrate (11). After application, the colorant provides a simulated patina to the copper substrate (11) surface while allowing the remaining non-coated portion of the substrate (11) to naturally patinate.</p>
申请公布号 WO2005009629(A1) 申请公布日期 2005.02.03
申请号 WO2004US21090 申请日期 2004.06.30
申请人 CROWN-PN L.L.C.;GREENBERG, PERCY 发明人 GREENBERG, PERCY
分类号 B05D5/06;B41M1/12;B41M1/28;B44C1/22;B44F9/10;(IPC1-7):B05D1/02;B05D1/32;B05D3/12;B05D1/28 主分类号 B05D5/06
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