| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which an inductance element formed in a resin package has a stable characteristic and the stability of a high frequency characteristic is improved. <P>SOLUTION: There are provided a semiconductor chip 21, a molded resin 1 sealing the semiconductor chip 21, and a plurality of conductor leads 3, 4 and 20 extending from an interior to an exterior of the molded resin 1. A part arranged inside the molded resins in the conductor leads forms an internal terminal 20b, and a part arranged outside the molded resin forms an external terminal 20c. An electrode of the semiconductor chip 21 is connected with the internal terminal 20b of each of the conductor leads. The internal terminal 20b of at least one of the conductor leads forms an inductance element, and the width of at least one part of the internal terminal 20b is narrower than that of the external terminal 20c. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
