发明名称 APPARATUS AND METHOD FOR PACKAGING ELECTRONIC COMPONENT, AND CALIBRATION JIG
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for packaging which can prevent an error of positioning accuracy in loading an electronic component from being caused and to provide a calibration jig used in a calibration process for correcting the error of the positioning accuracy. <P>SOLUTION: The calibration jig 27 is used to calibrate a positioning error in the apparatus for packaging the electronic component. In the jig 27, in order that a calibration mark 29a may be recognized by any of a substrate recognition camera 24 and a loading head recognition camera 22 having different imaging focus height positions, prisms 27a, 27b and a block 27b, reflecting units 28a, 28b are combined, and an imaging optical path length from the calibration mark 29a to the substrate recognition camera 22 is set equal to an imaging optical path length of a substrate recognition height H1. Thus, an error due to a thermal elongation or contraction of a movable part of the apparatus at an apparatus operating time can be calibrated, and the error of positioning accuracy in loading of the electronic part can be prevented from being caused. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032988(A) 申请公布日期 2005.02.03
申请号 JP20030196401 申请日期 2003.07.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MUKOJIMA HITOSHI
分类号 H05K13/04 主分类号 H05K13/04
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