| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for mounting a power semiconductor which can reduce wiring inductance and suppress the generation of an interference electromagnetic wave. <P>SOLUTION: A semiconductor chip 5 having an anode electrode and a cathode electrode provided on two opposing main surfaces is disposed and connected between plate-shaped anode wiring 3 and plate-shaped cathode wiring 4 so that currents flowing through the both electrodes are opposed to each other. A metal substrate having a main surface larger in width than the cathode wiring plate is located adjacent to the main surface of the anode wiring plate 3. Edges of the cathode wiring plate 4 are extended beyond edges of the anode wiring plate 3 and edges of the semiconductor chip 5. The extended dimension of the edge of the cathode wiring plate corresponds to half or more of a distance from the edge of the cathode wiring plate to the metal substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
