| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for packaging an substrate for efficiently packaging an etched wafer or the like with the surface of a material being exposed at low costs and effectively suppressing oxidation of the surface during storage, and to provide a package. SOLUTION: In a method for packaging the substrate W with the surface of the material being exposed, a laminated bag P containing the substrate W is placed in a chamber 2, the inside of the chamber 2 is evacuated, while nitrogen gas is supplied into the chamber 2 by supplying the nitrogen gas through a nitrogen gas nozzle 10 inserted in the opening of the laminated bag P, the opening of the laminated bag P is sealed to package the substrate W. Further, after the inside of the chamber 2 is evacuated and the nitrogen gas is supplied, the inside of the chamber 2 is evacuated again to supply nitrogen gas. COPYRIGHT: (C)2005,JPO&NCIPI |
