| 摘要 |
PROBLEM TO BE SOLVED: To suppress the kerf width and pitching generated when performing a dicing process using a laser beam. SOLUTION: When performing dicing of the laminate 15 after the completion of the wafer process, the laminate is first ground in advance to remove the electrode pad 16b formed on a silicon substrate 12 of a dicing region 20, and which is the constitution part of TEG and difficult to transmit the laser beam including the silicon oxidation film 14b and the passivation film 18b. COPYRIGHT: (C)2005,JPO&NCIPI |
