| 摘要 |
PROBLEM TO BE SOLVED: To provide a work cutting method using a band saw for stably supplying a highly precise wafer by achieving the stabilization of variation in the thickness of the wafer and the reduction of the undulation of the wafer when the work is cut by the band saw, and a work cutting apparatus therefor. SOLUTION: An increase or decrease in cutting resistance during cutting is detected from an increase or decrease in the quantity of the power of a first motor 5 for rotating a blade 2 and, corresponding to an increase or decrease in the cutting resistance or the consumption quantity of power, the cutting speed of a second motor 4 for moving the blade 2 in a cutting direction is controlled so as to be decreased or increased or to make the detected consumption quantity of power of the first motor 5 constant. COPYRIGHT: (C)2005,JPO&NCIPI |
