| 摘要 |
PROBLEM TO BE SOLVED: To securely prevent a cooling liquid for cooling heat generated from a semiconductor element from flowing into the face side supporting a circuit board of a heat-dissipating substrate. SOLUTION: A liquid escape groove 8 is provided in the outer periphery side from the cooling recess 7 of a cooling case 6. Moreover, there are provided a first sealing part 11 in the inner periphery side of the liquid escape groove 8, and a second sealing part 12 in the outer periphery side of the liquid escape groove 8, respectively, between the cooling case 6 and the heat-dissipating substrate 2. With the location that is located on the more outer periphery side than the second sealing part 12 and separate from the second sealing part 12 as a fastening location, the cooling case 6 is installed on the backside of the heat-dissipating substrate 2 by using a fastening member such as a fixing bolt 15 at this fastening location. By having such a structure, the flow of the cooling liquid into the circuit-supporting face side of the heat-dissipating substrate 2, especially, the flow of the cooling liquid through a bolt hole 16 is securely prevented. COPYRIGHT: (C)2005,JPO&NCIPI |
