| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card capable of reducing a damage to an electrode pad and an interlayer dielectric of a lower layer, reducing the generation of a crack, and performing a highly reliable test of a semiconductor device. SOLUTION: The tip part 3 of a probe needle 1 has a flat shape having an area of 78.5μm<SP>2</SP>or more. This probe card has a loading load setting means 20 for setting the loading load so that the loading load to the tip part 3 becomes 80 kgf/mm<SP>2</SP>or less when the tip part 3 presses the electrode pad 2, and a crossing angle setting means 30 for setting the crossing angle so that the crossing angle formed between a plane of the electrode pad 2 and a plane of the tip part 3 becomes 2°or less when the tip part 3 presses the electrode pad 2. COPYRIGHT: (C)2005,JPO&NCIPI
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