发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of recovering after maintenance of a plasma processing apparatus, which can further shorten release time after wet cleaning without leakage for the maintenance accompanied by an exposure to the atmosphere of a vacuum treatment chamber such as wet cleaning. SOLUTION: A function of predeterming the occurrence of leakage until a specified pressure is reached, a function of accelerating discharge of a residual gas in a chamber before and after a diagnosis of a sign of the leakage, and an exhausting sequence such as cycle purging are added, thereby allowing the device to be recovered in a short time while automatically or semiautomatically determining the acceptance. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005032934(A) 申请公布日期 2005.02.03
申请号 JP20030195339 申请日期 2003.07.10
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ONO TAKASHI;NAKADA KENJI;KANEKIYO TADAMITSU;OKIGUCHI MASASHI;UENO TORU;MATSUMOTO EIJI
分类号 H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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