发明名称 Inspection apparatus and inspection method
摘要 An object of the present invention is to provide a method for picking up, upon mounting an electronic part, an image of a board for mounting, a mounted part and a fixing agent that contain a potion such as an adhesive that transmits light so as to inspect the mounting state. In order to achieve the object, in the method according to the present invention, a camera disposed just above the board for mounting, a first light source disposed diagonally above the board and a second light source disposed diagonally above the board but at a position different from the first light source are integrated as a unit and they are moved in a direction substantially parallel to the board for mounting to determine the position of the first light source etc. at which the light transmissive portion can be preferably photographed.
申请公布号 US2005025353(A1) 申请公布日期 2005.02.03
申请号 US20040846543 申请日期 2004.05.17
申请人 TDK CORPORATION 发明人 KANEKO MASAAKI;NAKAYAMA HITOSHI;SUZUKI HIDETOSHI
分类号 G01B11/00;G01B11/24;G01N21/956;G06K9/00;G06T7/00;H01L21/00;H05K13/08;(IPC1-7):G06K9/00 主分类号 G01B11/00
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