发明名称 Leiterplatte und Elektronikkomponente
摘要 A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material. <IMAGE>
申请公布号 DE69730629(T2) 申请公布日期 2005.02.03
申请号 DE1997630629T 申请日期 1997.12.23
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TSUKAMOTO, MASAHIDE
分类号 H05K3/20;H01L21/60;H01L23/12;H01L23/31;H01L23/498;H05K1/11;H05K1/18;H05K3/00;H05K3/28;H05K3/40;H05K3/46;(IPC1-7):H05K3/40;H01L23/538 主分类号 H05K3/20
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