| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste capable of increasing the mixing ratio, enhancing reliability and migration resistance, decreasing the amount of silver used to raise cost competitiveness, and to provide a manufacturing method of the conductive paste. SOLUTION: The conductive paste contains conductive powder having a filling density of 68 vol.% or more in a relative value and a binder containing epoxy resin and alkoxy group-containing resol phenol resin, as a main component, substantially globular silver-covered copper powder is manufactured by covering almost the globular copper powder in which a part of the globular copper powder and an alloy part with covered silver are exposed, the surface of the silver-covering copper powder is covered with 0.02-1.0 wt% fatty acid to the globular silver-covered copper power, the silver-covering layer is smoothed, 60-85 wt% globular silver-covered copper powder covered with the fatty acid and 15-40 wt% silver powder are uniformly mixed to prepare high filling mixed powder, and the mixed powder is uniformly mixed with the binder. COPYRIGHT: (C)2005,JPO&NCIPI
|
