发明名称 |
PRODUCTION OF AN OPTOELECTRONIC COMPONENT THAT IS ENCAPSULATED IN PLASTIC, AND CORRESPONDING METHODS |
摘要 |
The invention relates to a simplified method for assembling optoelectronic components that are enclosed in plastic and the construction thereof. The individual component unit contains a semiconductor chip (11) and an optical window (10). A hermetic inclusion of at least the optically active areas of the semiconductor chip via the window ensues in the wafer-slicing process, i.e. before separation. A (window) wafer provided with recesses (7) and occupied, in areas, by a joining layer is joined to the pre-prepared semiconductor wafer (1) via the joining layer that seals the optically active areas. Before separation, the contact areas and the separating areas of the separation are exposed by a severing (8) that is precise with regard to the recesses. An inspection measuring of the component units can ensue when the wafers are joined. |
申请公布号 |
WO2004105117(A3) |
申请公布日期 |
2005.02.03 |
申请号 |
WO2004DE01045 |
申请日期 |
2004.05.19 |
申请人 |
X-FAB SEMICONDUCTOR FOUNDRIES AG;BUETTNER, SIEGFRIED;KNECHTEL, ROY |
发明人 |
BUETTNER, SIEGFRIED;KNECHTEL, ROY |
分类号 |
H01L21/50;H01L21/58;H01L27/14;H01L31/0203;H01L31/0232;H01L33/00 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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