| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for conveying a semiconductor wafer which can avoid yield decrease of a production caused by a dust deposited on a wafer holding means. SOLUTION: The method for conveying the semiconductor wafer includes pressing of a first brush of an alignment stage cleaning mechanism 29 against a water vacuum stage of an alignment stage 5 of the semiconductor wafer W prior to conveying of the semiconductor wafer W to the alignment stage 5, rotating of the wafer vacuum stage in this state, and removing of the dust deposited on the wafer vacuum stage. The method further includes moving of a second brush of a wafer chuck table cleaning mechanism 39 to a downward surface of a wafer chuck table 7, and removing of the dust deposited on the downward surface of the wafer chuck table 7. COPYRIGHT: (C)2005,JPO&NCIPI |
