| 发明名称 |
High density chip carrier with integrated passive devices |
| 摘要 |
A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.
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| 申请公布号 |
US2005023664(A1) |
申请公布日期 |
2005.02.03 |
| 申请号 |
US20040930304 |
申请日期 |
2004.08.31 |
| 申请人 |
CHUDZIK MICHAEL PATRICK;DENNARD ROBERT H.;DIVAKARUNI RAMA;FURMAN BRUCE KENNETH;JAMMY RAJARAO;NARAYAN CHANDRASEKHAR;PURUSHOTHAMAN SAMPATH;SHEPARD JOSEPH F.;TOPOL ANNA WANDA |
发明人 |
CHUDZIK MICHAEL PATRICK;DENNARD ROBERT H.;DIVAKARUNI RAMA;FURMAN BRUCE KENNETH;JAMMY RAJARAO;NARAYAN CHANDRASEKHAR;PURUSHOTHAMAN SAMPATH;SHEPARD JOSEPH F.;TOPOL ANNA WANDA |
| 分类号 |
H01L23/12;H01L23/50;H01L25/04;H01L25/18;H01L29/40;H05K1/16;H05K3/46;(IPC1-7):H01L21/44;H01L23/02;H01L23/52 |
主分类号 |
H01L23/12 |
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