| 摘要 |
A concealable chip leadframe unit structure is disclosed which is made up of multiple lead units arranged in order, each lead in the lead unit is formed by pressing and comprising of a piece body with upper placement plane, the lower surface of the piece body is pressed to form at least an inner conducting plane which can be connected to the chip, and at least one protruding bump is formed adjacent to the inner conducting plane, the end surface of the protruding bump is used as an out-conducting plane to be connected to outside; in this structure, chip can be attached to the upper placement plane of the lead structure, and the inner conducting plane can be connected to the chip through metallic wire. |
