| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated sheet suitably used in the mounting of a flip chip, excellent in bump filling properties, capable of obtaining excellent wafer processability and bringing about excellent electric connection reliability after resin sealing, a manufacturing method of a semiconductor using it and a semiconductor device manufactured by the manufacturing method. <P>SOLUTION: The laminated sheet is pasted on the circuit surface of a water with a projected electrode in a process for grinding the back of the water. At least the layer (layer A) coming into contact with the circuit surface of the laminated sheet is a thermosetting resin layer and the layer (layer B) directly laminated on the layer A is a flexible thermoplastic resin layer, of which the tensile modulus is 1-300 MPa at 40-80°C, for embedding the projected electrode while the outermost layer (layer C) is a thermoplastic resin layer non-plastic at least at 25°C. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
