| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for conveying a semiconductor wafer which can avoid yield decrease of a production due to a dust deposited on the semiconductor wafer. SOLUTION: The method for conveying the semiconductor wafer W includes placing of the semiconductor wafer W on an alignment stage 5, pressing of a first brush of a first cleaning mechanism 29 on a front surface of the semiconductor wafer W sucked and held on the alignment stage 5, rotating of the wafer vacuum stage in this state, and removing of a dust deposited on a front surface of the semiconductor wafer W. Further, the method includes moving of a second brush of a second cleaning mechanism 39 to the backside of the semiconductor wafer W sucked and held to a wafer chuck table 7, and removing of the dust deposited on the backside of the semiconductor wafer W. COPYRIGHT: (C)2005,JPO&NCIPI |
