| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing-die bonding sheet for a semiconductor device which enables low-temperature pasting with a silicon wafer and has no such problems as "jumping of chip" at the time of dicing and "chipping" at the time of picking up. SOLUTION: The dicing-die bonding sheet for a semiconductor device is manufactured by laminating a dicing sheet which is such that a pressure sensitive adhesive layer is formed on a base material and a die-bonding sheet which comprises at least an adhesive layer, in such a manner that the pressure sensitive adhesive layer and the adhesive layer may be adjacent to each other. By heating the pressure sensitive adhesive layer to a prescribed temperature or above, the dicing-die bonding sheet is turned into one with non-stickiness. COPYRIGHT: (C)2005,JPO&NCIPI |
