| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability wherein a semiconductor element can be operated at a high temperature. SOLUTION: The semiconductor device comprises an insulation substrate 1, semiconductor elements 3 located on one side face of the insulation substrate 1 via a metal layer 2, a heat insulation layer 11 so formed as to cover the surface of the semiconductor elements 3, a heat sink 5 which is so located that one side face may be bonded to the other side face of the insulation substrate 1, and a case 6 which is so mounted on the heat sink 5 as to surround the insulation substrate 1, the semiconductor elements 3, and the heat insulation layer 11, with the inside being filled up with a filler 9. COPYRIGHT: (C)2005,JPO&NCIPI |
