| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for obtaining a copper alloy foil which realizes high strength and high thermostability while keeping high electroconductivity, and has characteristics suitable for a material of a FPC and a film carrier. SOLUTION: The method for manufacturing the copper alloy foil comprises a first heat treatment of heating a cast copper alloy to 700 to 900°C and then cooling it to 300°C or lower at a temperature-lowering rate of 25°C or more per minute; a second heat treatment of heating it to 400 to 500°C and holding it for 30 minutes to 5 hours; and a step of finally rolling it to a thickness of 50μm or thinner. The above described copper alloy comprises 0.1-0.5 wt.% Fe, 0.1-0.5 wt.% Ni, 0.03-0.2 wt.% P, 0.1-3.0 wt.% Zn, and 0.01-2.0 wt.% Sn and the balance Cu, while a ratio of the total weight of Fe and Ni to the weight of P, namely (Fe+Ni)/P, is 3 to 10, and a ratio of the weight of Fe to the weight of Ni, namely Fe/Ni, is 0.8 to 1.2. COPYRIGHT: (C)2005,JPO&NCIPI
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