发明名称 |
Stacked memory and manufacturing method thereof |
摘要 |
To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.
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申请公布号 |
US2005023668(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20040901168 |
申请日期 |
2004.07.29 |
申请人 |
NEC TOSHIBA SPACE SYSTEMS, LTD. |
发明人 |
EBIHARA NOBUAKI;SUZUKI NAOSHI |
分类号 |
H01L25/18;H01L25/10;H01L25/11;H05K1/14;H05K3/32;H05K3/34;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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