发明名称 |
Method for assembling a ball grid array package with multiple interposers |
摘要 |
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener. The second surface of the second stiffener is attached to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate. The plurality of contact pads are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.
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申请公布号 |
US2005023677(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20040932278 |
申请日期 |
2004.09.02 |
申请人 |
BROADCOM CORPORATION |
发明人 |
ZHAO SAM ZIQUN;KHAN REZA-UR RAHMAN |
分类号 |
H01L23/367;H01L23/48;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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